The reverse engineering process

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Revision as of 07:32, 27 January 2011

For each chip, we follow these steps (see the PDFs for details):

  • get a chip, or more than one, which we can depackage
  • depackage it
  • take many photographs through a microscope of the metal layer
  • stitch into a single large image, correcting for distortions and overlaps
  • capture the polygons - at least for metal, usually also for contact cuts - into a data file
  • usually, deprocess the chip to expose the lower silicon layers
  • photograph, stitch and capture
  • convert the data files into a description we can simulate
  • investigate the behaviour of the chip by simulation
  • investigate the layout and logic design
  • write up our results on this wiki
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